Senior Process, Semiconductor Manufacturing & Advanced Packaging Engineer
Longhorn IP Labs — Frisco, Texas
Longhorn IP Labs is expanding its deep‑technology research and analysis team and is seeking a Senior Process, Semiconductor Manufacturing & Advanced Packaging Engineer with world‑class expertise in advanced packaging, thermal management, semiconductor process integration, and technology evaluation. This role is ideal for an engineer capable of supporting and advancing technologies similar to those pioneered by Katana Silicon Innovations LLC and Mago Barca IP LLC, including advanced thermal interfaces, 3D/2.5D integration, interconnect innovation, semiconductor structures, and high‑performance cooling architectures.
This position uniquely blends hands‑on semiconductor engineering with high‑level IP and technology analysis, supporting Longhorn IP Labs’ mission to drive innovation across advanced semiconductor domains.
Key Responsibilities
Semiconductor Process & Advanced Packaging
• Develop, evaluate, and optimize semiconductor manufacturing flows for advanced packaging, including 2.5D/3D integration, chiplets, interposers, TSVs, and wafer‑level packaging.
• Analyze and validate thermal management structures, including TIMs, vapor chambers, micro‑channels, engineered heat‑spreaders, and high‑power cooling assemblies.
• Conduct FEOL/BEOL integration assessments, reliability studies, and materials characterization.
• Collaborate with inventors, researchers, and external partners to refine next‑generation semiconductor and packaging concepts.
• Interface with foundries, OSATs, and materials vendors to evaluate manufacturability and process compatibility.
Technology Analysis & IP Support
• Perform deep technical analysis of semiconductor, packaging, and thermal‑management technologies across Longhorn IP Labs’ portfolio.
• Prepare claim charts, including element‑by‑element mapping of patent claims to semiconductor processes, packaging structures, and device architectures.
• Review and refine claim charts prepared by internal and external teams for accuracy, technical rigor, and litigation readiness.
• Conduct reverse‑engineering‑based technical assessments to support patent licensing, enforcement, and technology evaluation.
• Draft technical rebuttals and non‑infringement/invalidity analyses in response to patent assertions involving semiconductor manufacturing, packaging, thermal structures, and related technologies.
• Support expert‑level technical narratives for licensing discussions, litigation strategy, and technology positioning.
Cross‑Functional Collaboration
• Work closely with IP attorneys, licensing executives, and technical experts to translate complex engineering concepts into clear, defensible IP positions.
• Provide technical leadership in evaluating technologies similar to those in the portfolios of Katana Silicon Innovations LLC and Mago Barca IP LLC.
• Contribute to invention harvesting, portfolio development, and next‑generation R&D initiatives.
Required Experience
• 7+ years in semiconductor process engineering, advanced packaging, thermal management, or related manufacturing roles.
• Hands‑on experience with 2.5D/3D packaging, chiplet integration, interposers, TSVs, thermal interface materials, or high‑performance cooling structures.
• Strong understanding of FEOL/BEOL integration, wafer‑level packaging, and reliability engineering.
• Experience preparing or reviewing claim charts, technical reports, or technology assessments.
• Ability to analyze patent claims and map them to real‑world semiconductor processes or device structures.
• Familiarity with IP‑driven R&D, licensing, or litigation environments.
Preferred Qualifications
• M.S. or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• Experience with GPU/AI accelerator packaging, high‑power device cooling, or advanced thermal architectures.
• Prior involvement in patent assertion, defense, or technology‑based licensing programs.
• Strong communication skills and ability to collaborate across multidisciplinary teams.
Why Join Longhorn IP Labs
You will join a rapidly growing research organization at the forefront of semiconductor packaging, thermal management, AI hardware, and next‑generation device architectures. This role offers a rare opportunity to work at the intersection of deep engineering, advanced research, and high‑impact intellectual property development, shaping the future of semiconductor innovation.
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